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data shee t thick film chip resistors introduction product specification ? mar 25, 2008 v.7
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 2 16 ?? ctc: this unique number is an easily-readable code. global part number is preferred. ?? 15 digits code (phycomp ctc): phycomp branded products ?? 14~18 digits code (global part number): yageo/phycomp branded products ?? 12nc: in general,the tolerance,packing and resistance code are integral parts of this number. ?? phycomp branded product further informations will be mentioned in the relevant data sheet. functional description the functional description includes: nominal resistance range and tolerance, limiting voltage, temperature coefficient, absolute maximum dissipation, climatic category and stability. the limiting voltage (dc or rms) is the maximum voltage that may be continuously applied to the resistor element, see ?iec publications 60115-8? . the laws of heat conduction, convection and radiation determine the temperature rise in a resistor owing to power dissipation. the maximum body temperature usually occurs in the middle of the resistor and is called the hot-spot temperature. in the normal operating temperature range of chip resistors the temperature rise at the hot-spot, .t, is proportional to the power dissipated: ? t = a p. the proportionally constant ?a? gives the temperature rise per watt of dissipated power and can be interpreted as a thermal resistance in k/w. this thermal resistance is dependent on the heat conductivity of the materials used (including the pcb), the way of mounting and the dimensions of the resistor. the sum of the temperature rise and the ambient temperature is: t m = t amb + ? t where: t m = hot-spot temperature t amb = ambient temperature ? t = temperature rise at hot-spot. the stability of a chip resistor during endurance tests is mainly determined by the hot-spot temperature and the resistive materials used. introduction data in data sheets is presented - whenever possible -according to a 'format', in which the following chapters are stated: ?? title ?? scope ?? application ?? features ?? ordering information ?? marking ?? construction ?? dimensions ?? electrical characteristics ?? packing style and packaging quantity ?? functional description ?? tests and requirements the chapters listed above are explained in this section ?introduction thick film chip resistors? , with detailed information in the relevant data sheet. chapters ?mounting? , ?packing? , and ?marking? are detailed in separate sections. description all thick film types of chip resistors have a rectangular ceramic body. the resistive element is a metal glaze film. the chips have been trimmed to the required ohmic resistance by cutting one or more grooves in the resistive layer. this process is completely computer controlled and yields a high reliability. the terminations are attached using either a silver dipping method or by applying nickel terminations, which are covered with a protective epoxy coat, finally the two external terminations (matte tin on ni-barrier) are added. the resistive layer is coated with a colored protective layer. this protective layer provides electrical, mechanical and/or environmental protection - also against so ldering flux and cleaning solvents, in accordance with ?mil-std-202g?, method 215 and ?iec 60115-4.29? . yageo thick film chip resistor is flameproof and can meet ?ul94v-0? . ordering information - 12nc & global clear text code resistors are ordered in two ways. both ways give logistic and packing information.
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 3 16 s s u u m m m m a a r r i i z z i i n n g g description relationship dimensions, conductance of materials and mounting determine heat resistance heat resistance dissipation gives temperature rise temperature rise + ambient temperature give hot-spot temperature p p e e r r f f o o r r m m a a n n c c e e when specifying the performance of a resistor, the dissipation is given as a function of the hot-spot temperature, with the ambient temperature as a parameter. from ? t = a p and t m = t amb ? ? t it follows that: a t t p amb m ? ? if p is plotted against tm for a constant value of a, parallel straight lines are obtained for different values of the ambient temperature. the slope of these lines, a i dt dp m ? handbook, full pagewidth mga208 r nom 2.6% 1.6% 1.6% 2.6% t ( c) o 16 155 25 0 55 26 fig. 1 temperature coefficient. is the reciprocal of the heat resistance and is the characteristic for the resistor and its environment. t t h h e e t t e e m m p p e e r r a a t t u u r r e e c c o o e e f f f f i i c c i i e e n n t t the temperature coefficient of resistance is a ratio which indicates the rate of increase (decrease) of resistance per degree (c) increase (decrease) of temperature within a specified range, and is expressed in parts per million per c (ppm/c). e xample if the temperature coefficient of a resistor of r nom = 1 k x between ?55 c and +155 c is 200 ppm/c, its resistance will be: at 25 c: 1,000 x (nominal = rated value) at +155 c: 1,000 x (130 200 ppm/c) 1,000 x = 1,026 x or 974 x at ?55 c: 1,000 x (80 200 ppm/c) 1,000 x = 1,016 x or 984 x if the temperature coefficient is specified as 200 ppm/c the resistance will be within the shaded area as shown in fig. 1.
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 4 16 n n o o i i s s e e most resistors generate no ise due to the passage of current through the resistor . this noise is dependent on the amount of current, the resistive material and the physical construction of the resistor. the physical construction is part ly influenced by the laser trimming process, which cuts a groove in the resistive material. typical current noise levels are shown in fig. 2. f f r r e e q q u u e e n n c c y y b b e e h h a a v v i i o o u u r r resistors in general are designed to function according to ohmic laws. this is basically true of rectangular chip resistors for frequencies up to 100 khz. at higher frequencies, the capacitance of the terminations and the inductance of the resistive path length begin to have an effect. basically, chip resistors can be represented by an ideal resistor switched in series with a coil and both switched parallel to a capacitor. the values of the capacitance and inductance are mainly determined by the dimensions of the terminations and the conductive path length. the trimming pattern has a negligible influence on the inductance, as the path length is not influenced. also, its influence on the capacitance is negligible as the total capacitance is largely determined by the terminations. the environment surrounding chips (e.g. landing paths, nearby tracks and th e material of the printed- circuit board) has a large influence on the behaviour of the chip on the printed-circuit board. 12 8 4 0 28 24 36 32 20 16 1 10 100 1k 1m r ( ) scr028 100 k 10 k 10 m noise level v v fig. 2 typical noise levels as a function of rated resistance size 1206
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 5 16 0 2.0 10 10 scr027 10 9 10 8 10 7 10 6 0.4 0.8 1.2 1.6 z r f (hz) r = 1 m n r = 100 k n r = 10 k n r = 1 k n r = 100 n r = 10 n r = 1 n fig. 4 impedance as a function of frequency for a chip resistor size 0402
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 6 16 handbook, full pagewidth 0 2.0 10 10 mlb716 10 9 10 8 10 7 10 6 0.4 0.8 1.2 1.6 z r f (hz) r = 1 m n r = 100 k n r = 10 k n r = 1 k n r = 100 n r = 10 n r = 1 n fig. 5 impedance as a function of frequency for a chip resistor handbook, full pagewidth 100 100 10 10 mlb717 10 9 10 8 10 7 10 6 60 20 20 60 f (hz) r = 1 m n r = 100 k n r = 10 k n r = 1 k n r = 100 n r = 10 n r = 1 n ? (deg) fig. 6 phase shift as a function of frequency for a chip resistor size 0603 size 0603
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 7 16 handbook, full pagewidth 0 2.0 10 10 mlb718 10 9 10 8 10 7 10 6 0.4 0.8 1.2 1.6 z r f (hz) r = 1 m n r = 100 k n r = 10 k n r = 1 k n r = 100 n r = 10 n r = 1 n fig. 7 impedance as a function of frequency for a chip resistor handbook, full pagewidth 100 100 10 10 mlb719 10 9 10 8 10 7 10 6 60 20 20 60 f (hz) r = 1 m n r = 100 k n r = 10 k n r = 1 k n r = 100 n r = 10 n r = 1 n ? (deg) fig. 8 phase shift as a function of frequency for a chip resistor size 0805 size 0805
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 8 16 handbook, full pagewidth 0 2.0 10 10 mlb720 10 9 10 8 10 7 10 6 0.4 0.8 1.2 1.6 z r f (hz) r = 1 m n r = 100 k n r = 10 k n r = 1 k n r = 100 n r = 10 n r = 1 n fig. 9 impedance as a function of frequency for a chip resistor size 1206 handbook, full pagewidth 100 100 10 10 mlb721 10 9 10 8 10 7 10 6 60 20 20 60 f (hz) r = 1 m n r = 100 k n r = 10 k n r = 1 k n r = 100 n r = 10 n r = 1 n ? (deg) fig. 10 phase shift as a function of frequency for a chip resistor size 1206
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 9 16 parameter value exponential time constant 50 to 700 s repetition time 12 to 25 s amount of pulses 5 to 10 ta b l e 1 pulse load limits p p u u l l s s e e - - l l o o a a d d b b e e h h a a v v i i o o u u r r the load, due to a single pulse at which chip resistors fail by going open circuit, is determined by shape and time. a standard way to establish pulse load limits is shown in table 1. with this test, it can be determined at which applied voltage the resistive value changes about 0.5% of its nominal value under the above mentioned t hat may be applied in a regular way can be determined in a similar manner. pulse conditions. fig. 11 shows test results for the size 1206 chip resistors. if applied regularly the load is destructive, therefore the load must not be applied regularly during the load life of the resistors. however, the magnitude of a pulse at which failure occurs is of little practical value. the maximum ?single-pulse? load 10 10 2 10 3 10 4 10 5 10 6 10 7 mbd641 10 4 10 10 2 10 3 v r ( ) n 1.2/50 s 10/700 s max (v) fig. 11 maximum permissible peak pulse voltage ) v ? ( max without failing to ?open circuit? in accordance with din iec 60040 (co) 533 size 1206
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 10 16 600 200 0 400 mbd586 10 1 1 10 2 10 3 10 4 10 5 10 6 v max (v) t (s) i fig. 13 pulse on a regular basis; maximum permissible peak pulse voltage ) v ? ( max as a function of pulse duration (t i ). handbook, full pagewidth 10 6 mbc188 10 3 10 1 1 10 10 2 10 5 10 4 10 3 10 2 1 10 1 p max (w) t (s) i t / t = 1000 pi single pulse repetitive pulse size 1206 size 1206 fig. 12 pulse on a regular basis; maximum permissible peak pulse power ) p ? ( max as a function of pulse duration for r ? 10 k ? , single pulse and repetitive pulse t p /t i = 1,000
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 11 16 d d e e t t e e r r m m i i n n a a t t i i o o n n o o f f p p u u l l s s e e - - l l o o a a d d the graphs in figs 12 and 13 may be used to determine the maximum pulse-load for a resistor. ?? for repetitive rectangular pulses: ?? r v ? 2 i must be lower than the value of max p ? given by the solid lines of fig. 12 for the applicable value of t i and duty cycle t p /t i . ?? i v ? must be lower than the value of max v ? given in fig. 13 for the applicable value of t i . ?? for repetitive exponential pulses: ?? as for rectangular pulses, except that t i = 0.5 ? . ?? for single rectangular pulses: ?? r v ? 2 i must be lower than the max p ? given by the dashed line of fig. 12 for the applicable value of t i . ?? i v ? must be lower than the value of max v ? given in fig. 13 for the applicable value of t i . d d e e f f i i n n i i t t i i o o n n s s o o f f p p u u l l s s e e s s s ingle pulse the resistor is considered to be operating under single pulse conditions if, during its life, it is loaded with a limited number (approximately 1,500) of pulses over long time intervals (greater than one hour). r epetitive pulse the resistor is operatin g under repetitive pulse conditions if it is loaded by a continuous train of pulses of similar power. the dashed line in fig. 12 shows the observed maximum load for the size 1206 chip resistors under single-pulse loading. more usually, the resistor must withstand a continuous train of pulse s of repetition time ?t p ? during which only a small resistance change is acceptable. this resistance change ( ? r/r) is equal to the change permissible under continuous load conditions. the continuous pulse train and small permissible resistance change reduces the maximum handling capability. the continuous pulse train maximum handling capacity of chip resistors has been determined experimentally. measurements have shown that the handling capacity varies with the resistive value applied. however, maximum peak pulse voltages as indicated in fig. 13, should not be exceeded.
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 12 16 v t ynsc059 ^ 0.37 v max ^ v max t p e e x x a a m m p p l l e e s s determine the stability of a typical resistor for operation under the following pulse-load conditions. c ontinuous plus train a 100 x ? resistor is required to operate under the following conditions: v i = 10 v; t i = 10 ?5 s; t p = 10 ?2 s therefore: 1 100 10 p ? 2 ? ? w and 000 , 1 10 10 t t 5 2 i p ? ? ? ? for t i = 10 ?5 s and 000 , 1 t t i p ? , fig. 12 gives max p ? = 2 w and fig. 13 gives max v ? = 400 v as the operating conditions p ? = 1 w and i v ? = 10 v are lower than these limiting values, this resistor may be safely used. s ingle pluse a 10 k x ? resistor is required to operate under the following conditions: i v ? = 250 v; t i = 10 ?5 s therefore: 25 . 6 000 , 10 250 p ? 2 max ? ? w the dashed curve of fig. 12 shows that at t i = 10 ?5 s, the permissible max p ? = 10 w and fig. 13 shows a permissible max v ? of 400 v, so this resistor may be used. mga206 t i v t t p ^ v i fig. 14 rectangular pulses d d e e f f i i n n i i t t i i o o n n o o f f s s y y m m b b o o l l s s ( ( s s e e e e f f i i g g u u r r e e s s 1 1 1 1 , , 1 1 2 2 , , 1 1 3 3 , , 1 1 4 4 a a n n d d 1 1 5 5 ) ) symbol description p ? applied peak pulse power max p ? maximum permissible peak pulse power (fig.12) i v ? applied peak pulse voltage (fig. 14) max v ? maximum permissible peak pulse voltage (figs. 11, 13 and 15) r nom nominal resistance value t i pulse duration (rectangular pulses) t p pulse repetition time ? time constant (exponential pulses) t amb ambient temperature t m (max.) maximum hot-spot temperature of the resistor fig. 15 exponential pulses
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 13 16 mechanical dat a m m a a s s s s p p e e r r 1 1 0 0 0 0 u u n n i i t t s s ta b l e 3 r esistor arrays, networ k and rf attenuators product size code type mass (g) 0404 atv321 0.100 2 x 0201 (4p2r) yc102 0.052 2 0402 (4p2r) yc122 0.100 2 x 0402 (4p2r) tc122 0.112 4 0402 (8p4r) yc124 0.281 4 x 0402 (8p4r) tc124 0.311 2 x 0603 (4p2r) yc162 0.376 4 0603 (8p4r) yc/tc164 1.031 1220 (8p4r) yc324 2.703 0616 (16p8r) yc248 0.885 0612 (10p8r) yc158 0.855 1225 (10p8r) yc358 3.333 product size code mass (g) 0201 0.016 0402 0.058 0603 0.192 0805 0.450 1206 0.862 1210 1.471 1218 2.703 2010 2.273 2512 3.704 ta b l e 2 single resistor chips type failure in time (fi t ) c c a a l l c c u u l l a a t t i i o o n n m m e e t t h h o o d d : : according to yageo calculation, assuming components lif e time is following expone ntial distribution and using 60% confidence interval (60% c.i.) in homogeneous poisso n process; therefore the fit is calculated by number of tested failure in endurance test (r ated power at 70c for 1,000 hours, ?iec 60115-1 4.25.1? ) as following: 9 10 test time d a ccumulate failure estimated o f number c.i. 60% ) ( fit ? ? ? type fit in 1999-2007 accumulation test in 1999-2007 (hours) rc0201 146 6,280,000 rc0402 65 14,150,000 rc0603 63 14,650,000 rc0805 63 14,720,000 rc1206 69 13,380,000 rc1210 78 11,750,000 rc2010 65 14,190,000 rc2512 81 11,310,000 ta b l e 4 fit of single resistor chips type fit in 1999-2007 accumulation test in 1999-2007 (hours) yc122 590 1,560,000 tc164 548 1,560,000 yc124 390 1,560,000 yc158 390 1,560,000 yc164 339 1,710,000 yc248 390 1,560,000 yc324 390 1,560,000 yc358 390 1,560,000 ta b l e 5 fit of resistor arrays and networ k
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 14 16 tests and procedures to guarantee zero defect production standard, statistical process control is an essential part of our production processes. furthermore, ou r production process is operating in accordance with ?iso 9000? . essentially all tests on resistors are carrie d out in accordance with the schedule of ?iec publication 60115-1? in the specified climatic category and in accordance with ?iec publication 60068? , ?mil-std? , ?jis c 5202? , and ?eia/is? , etc. in some instances deviations from the iec recommendations are made. tests and their requirements are descri bed in detail in the data sheets. handbook, halfpage 300 tc (10 /k) 6 200 100 0 100 200 300 1 10 100 1k 1m r ( ) mga210 100 k 10 k 10 m spec. level spec. level fig. 16 typical temperature coefficients between the lower and upper category temperatures size 1206 handbook, halfpage 1.2 0.8 0.4 0 0.4 0.8 1.2 1 10 100 1k 1m r ( ) mga214 100 k 10 k 10 m spec. level spec. level (%) r r fig. 17 typical percentage change in resistance af ter soldering for 10 seconds at 270 c, completely immersed size 1206 handbook, halfpage 12 8 4 0 100 1k 1m r ( ) mga213 100 k 10 k noise level spec. level v v fig. 18 typical noise level as a function of rated resistance measured using quantech - equipment size 1206 handbook, halfpage 2 1 0 1 2 1 10 100 1k 1m r ( ) mga216 100 k 10 k 10 m spec. level spec. level (%) r r fig. 19 typical percentage change in resistance af ter 56 days at 40 c and 90 to 95% relative humidity loaded with p nom size 1206
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 15 16 handbook, halfpage 1.2 0.8 0.4 0 0.4 0.8 1.2 1 10 100 1k 1m r ( ) mga218 100 k 10 k 10 m spec. level spec. level (%) r r fig. 20 typical percentage change in resistance after 1,000 hours loaded with p nom at 70 c ambient temperature size 1206
www.yageo.com mar 25, 2008 v.7 introduction thick film technology product specification chip resistor surface mount 16 16 revision history revision date change notification description version 7 mar 25, 2008 - - headline changes to introduction thick f ilm chip resistor - add international standa rd and failures in time version 6 dec 15, 2004 - - converted to yageo / phycomp brand - separated ?marking? into an individual data sheet - mechanical data extended from size s 0201 to 2512, resistor arrays/network and attenuators as well - impedance chart for size 0402 added version 5 jul 23, 2004 - - size extended to 0201 version 4 aug 19, 2004 - - updated company logo version 3 may 30, 2001 - - converted to phycomp brand

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